Reduced profile EMI receptacle assembly

摘要

The present invention provides for a receptacle printed circuit board assembly having a reduced profile of the entire assembly where the receptacle has a board receiving portion that mounts at a cut-out edge of a printed circuit board so that the majority of the receptacle is mounted within a cut-out area of the printed circuit board recessed below the upper face of the printed circuit board so that the overall profile of the receptacle assembly is reduced. A shield flap or metallic hood is provided that helps to attach the receptacle to the printed circuit board and completely enclose the shielded portion of the receptacle.