发明名称 Method and apparatus for forming deposited film
摘要 A method for forming a deposited film, comprising generating plasma in a plurality of successive vacuum containers and continuously forming a deposited film on a belt-like substrate while continuously moving the substrate in its longitudinal direction, wherein an opening of a discharge container is adjusted with an opening adjusting plate having a shape set so as to reduce ununiformity of a deposited film thickness in a width direction of the substrate on the basis of a measurement of a deposition rate distribution. Accordingly, there is provided a method and an apparatus for forming a deposited film which are capable of producing a photovoltaic element without ununiformity in characteristics by depositing semiconductor layers without ununiformity in thickness and quality.
申请公布号 US6667240(B2) 申请公布日期 2003.12.23
申请号 US20010800724 申请日期 2001.03.08
申请人 CANON KABUSHIKI KAISHA 发明人 OZAKI HIROYUKI;KANAI MASAHIRO;OKADA NAOTO;MORIYAMA KOICHIRO;SHIMODA HIROSHI
分类号 C23C16/50;C23C16/511;C23C16/52;C23C16/54;H05H1/24;(IPC1-7):H01L21/311 主分类号 C23C16/50
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