发明名称 |
Polishing method and apparatus |
摘要 |
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.
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申请公布号 |
US6667238(B1) |
申请公布日期 |
2003.12.23 |
申请号 |
US20000545504 |
申请日期 |
2000.04.07 |
申请人 |
EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
KIMURA NORIO;SHIRAKASHI MITSUHIKO;TOKUSHIGE KATSUHIKO;ASAMI MASAO;MIYASHITA NAOTO;KODERA MASAKO;MATSUI YOSHITAKA;NADAHARA SOICHI;TOMITA HIROSHI |
分类号 |
H01L21/304;H01L21/302;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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