发明名称 |
Cooling assembly for a heat producing assembly |
摘要 |
A cooling assembly for dissipating heat produced in a heat generating component of an electronic system includes a shroud assembly. The cooling assembly also includes a heat dissipating device removably housed within the shroud assembly and a fan assembly removably housed within the shroud assembly. The shroud assembly further includes a plurality of mounting assemblies slidably attached to the shroud assembly and configured to removably secure the cooling assembly in thermal connection to the heat generating component.
|
申请公布号 |
US6667882(B2) |
申请公布日期 |
2003.12.23 |
申请号 |
US20020144785 |
申请日期 |
2002.05.15 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
PAUSER DONALD GEORGE |
分类号 |
H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|