发明名称 Cooling assembly for a heat producing assembly
摘要 A cooling assembly for dissipating heat produced in a heat generating component of an electronic system includes a shroud assembly. The cooling assembly also includes a heat dissipating device removably housed within the shroud assembly and a fan assembly removably housed within the shroud assembly. The shroud assembly further includes a plurality of mounting assemblies slidably attached to the shroud assembly and configured to removably secure the cooling assembly in thermal connection to the heat generating component.
申请公布号 US6667882(B2) 申请公布日期 2003.12.23
申请号 US20020144785 申请日期 2002.05.15
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 PAUSER DONALD GEORGE
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
代理机构 代理人
主权项
地址