| 摘要 |
FIELD: electronic engineering; mobile radio link devices. SUBSTANCE: printed- circuit board medium is first covered with layer of interlayer micro connections on one or both sides. Then high-frequency circuits and high-frequency structures of conducting tracks are deposited on at least part of this layer of interlayer micro connections. After that high-frequency circuits and high-frequency structures of conducting tracks are protected relative to high-frequency ground layer of printed- circuit board medium against disturbing actions impairing high-frequency parameters of high-frequency circuits or, respectively, high-frequency conducting tracks with aid of cutoff regions disposed in carrier layer of printed-circuit board directly under layer of interlayer micro connections . EFFECT: enhanced packing density of electronic circuits and structures of conducting tracks on printed-circuit boards. 14 cl, 10 dwg
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