发明名称 SOLDER FOR LOW-TEMPERATURE SOLDERING
摘要 FIELD: soldering processes and devices, namely composition of tin-base solder used for leveling front surface of automobile bodies at condition of conveyer assembling automobiles and at repairing works. SUBSTANCE: composition of solder for low-temperature soldering containing tin, copper, zinc, antimony and nickel contains in addition iron, bismuth, cadmium, manganese, silver, silicon at next relation of ingredients, mass%: copper, 8 -20; zinc, up to 2.1; iron, 0.05 - 2.0; nickel, 0.1 - 1.0; antimony, 0.1 - 0.5; bismuth, up to 0.1; cadmium, up to 0.05; manganese, up to 0.05; silver, up to 0.05; silicon, up to 0.05; tin, the balance. Solder according to invention satisfies to demands for soldering onto vertical surfaces of articles of steels and non-ferrous alloys, particularly butt joints of automobile bodies with leveling their front surface, possibly in wide temperature interval 200 -240 C at soldering by means of gas torch. EFFECT: enhanced properties of solder suitable for soldering on vertical surfaces of automobile bodies. 1 tbl
申请公布号 RU2219030(C1) 申请公布日期 2003.12.20
申请号 RU20020113827 申请日期 2002.05.27
申请人 发明人 PRISHVIN D.S.;SHISHKINA Z.I.;PAVLOV B.A.;SHCHERBAKOV N.V.
分类号 B23K35/26;C22C13/02;(IPC1-7):B23K35/26 主分类号 B23K35/26
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