HIGH SPEED, CONTROLLED IMPEDANCE AIR DIELECTRIC ELECTRONIC BACKPLANE SYSTEMS

摘要

The invention is a novel backplane interconnection system (5) that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system (15) that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiments are also integrated with conventional printed circuit backplanes or can be a stand-alone device.