IC CARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: Provided are an IC card with reduced electrical resistance by making an antenna and a substrate directly contact each other, a maximum efficiency of recognizing a high-frequency signal and an ensured safety, and a manufacturing of the IC card. CONSTITUTION: The IC card comprises: an antenna circuit pattern(31') having an antenna unit, a chip bump unit and an external contact pad mounting unit; a combined chip(35) adhered to the chip bump unit; at least one dielectric layer(39, 40) mounted on the antenna circuit pattern(31'); and an external contact pad inserted into a cavity formed at a portion of the dielectric layer(39, 40), having various interconnected terminals formed on external and internal surfaces of a substrate(47), the terminals being electrically connected to the external contact pad mounting unit by a clad layer(48) formed on the internal surface of the cavity.