| 摘要 |
This invention relates to aqueous electroless nickel plating solutions, a nd more particularly, to nickel plating solutions based on nickel salts of alky l sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal io ns capable of forming an insoluble orthophosphite.
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