发明名称 COOLING DEVICE
摘要 The invention relates to a cooling device comprising a heat-conducting cooling plate (6) on the side of the electronic power components (5) to be cooled and a platelike cooling fluid distributing device (4). The distributing device has cooling fluid outlets (9) on the side facing the cooling plate (6), said outlets being arranged at a distance from and pointing towards the cooling plate (6). The distributing device (4) also comprises at least one drain outlet (10) for the cooling fluid. The invention aims at providing a cooling device which is suitable for different forms of power components and ensures even cooling throughout the entire cooling surface for different forms and number of power components while simplifying the production of said cooling device. In order to achieve said aims, the cooling device (4) comprises a first plate (1) in which outlets (9) and a plurality of drain outlets (10) are evenly distributed and a second plate (2) and a third plate (3) which are superimposed, wherein two plates (1, 2: 2, 3:) define a feed channel (13) that is connected to al outlets (9) and a drain channel (12) that is connected to all drain outlets (10).
申请公布号 WO03063240(A3) 申请公布日期 2003.12.18
申请号 WO2003DK00038 申请日期 2003.01.22
申请人 DANFOSS SILICON POWER GMBH;EISELE, RONALD;OLESEN, KLAUS, KRISTEN 发明人 EISELE, RONALD;OLESEN, KLAUS, KRISTEN
分类号 F28F3/08;F28F13/02;H01L23/367;H01L23/473;H05K7/20 主分类号 F28F3/08
代理机构 代理人
主权项
地址