| 摘要 |
<p>Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation factor thereof as high as 60% or greater but also the load required for 60% compression deformation is as small as 60 mN or less. Therefore, when wiring board coupling is carried out by the use of an anisotropic conductive adhesive, the anisotropic conductive adhesive obtained by first producing conductive particles having a conductive layer formed on resin particle surfaces by adhering a conductive material to the surface of the above resin particles as a core and thereafter dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metal wires of the wiring boards are extensively deformed at slight loading, so that electrical appliances of high conduction reliability can be obtained.</p> |
