SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to improve process efficiency by emitting a wire bonding process and to make the entire thickness of the package thinner by making the connection part of a semiconductor chip and a circuit composed of a thin film. CONSTITUTION: A cavity(21a) is formed in the center of a metal frame(21). A semiconductor chip(22) is placed in the cavity of the metal frame, including a plurality of bumps(22a). An opening is formed in the center of a circuit part(23) and a circuit(23b) of a predetermined pattern is formed in the outside of the circuit part. The circuit part is attached to a portion near the cavity of the metal frame so that the semiconductor chip is exposed through the opening. A conductive connection part of a predetermined pattern is included in a connection film(25) to connect the circuit with the bump of the semiconductor chip. A conductive adhesion layer is disposed between the semiconductor chip/circuit part and the connection film to fix them. The conductive adhesion layer electrically connects the bump of the semiconductor chip with the conductive connection part of the connection film and connects the circuit of the circuit part with the conductive connection part of the connection film, respectively. A solder ball(27) is electrically connected to the circuit.