| 摘要 |
<p>A conductive paste which is excellent in conductivity, adherence to substrates and long-term stability thereof and which when used in filling through-holes of a multilayer board, enhances the reliability of bonding with conductive layer end faces in the through-holes to thereby render through-hole plating or the like unnecessary. The conductive paste comprises resin components containing an acrylate resin and an epoxy resin (A) and, per 100 pts.wt. thereof, 200 to 1800 pts.wt. of powder of two or more metals containing at least one low-melting-point metal whose melting point is 180˚C or below and at least one high-melting-point metal whose melting point is 800˚C or higher (B), 0.5 to 40 pts.wt. of a curing agent containing 0.3 to 35 pts.wt. of a phenolic curing agent (C) and 0.3 to 80 pts.wt. of a flux (D).</p> |
