发明名称 Temperature-measuring device
摘要 At the time when a temperature of a semiconductor wafer or the like is measured by light without contacting to it, its temperature is measured with high precision without suffering from an influence of changes in temperature of a light source, an influence of a bent degree or the like of an optical fiber or an influence of a displacement of an optical system such as a lens or the like. Light output from the light source is irradiated to the semiconductor wafer through an optical fiber for irradiated light. The light reflected from the semiconductor wafer is output as reflected light through an optical fiber for the reflected light. An optical fiber for reference light having substantially the same route as those of the optical fiber for irradiated light and the optical fiber for reflected light is disposed. The light output from the light source is output as the reference light through the optical fiber for reference light without being irradiated to or reflected from the semiconductor wafer. And, a temperature of the semiconductor wafer is measured according to the reflected light output from the optical fiber for reflected light and the reference light output from the optical fiber for reference light.
申请公布号 US2003231694(A1) 申请公布日期 2003.12.18
申请号 US20030394206 申请日期 2003.03.24
申请人 OHSAWA AKIHIRO 发明人 OHSAWA AKIHIRO
分类号 G01J1/10;G01J5/00;G01J5/02;G01J5/08;G01J5/10;G01J5/58;H01L21/027;(IPC1-7):G01J5/00 主分类号 G01J1/10
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