POLISHING HEAD AND POLISHING APPARATUS USING THE SAME

摘要

PURPOSE: A polishing head and a polishing apparatus using the same are provided to be capable of uniformly polishing a wafer for improving the reliability of a semiconductor device and reducing process failure. CONSTITUTION: A polishing head(10) is provided with a body part(30) having at least one air path for guiding air and a wafer adsorption part(40) installed at the lower portion of the body part for contacting the back side of a wafer by using the air pressure supplied from the air path. The polishing head further includes a retainer ring(50) installed around the edge portion of the wafer adsorption part at the lower portion of the body part for preventing the deviation of the wafer and a slurry supply line(60) for supplying slurry form the upper portion of the body part to the edge portion of the wafer adsorption part.