发明名称 APPARATUS FOR TRANSFERRING WAFER
摘要 PURPOSE: An apparatus for transferring a wafer is provided to properly transfer the wafer by removing the particles formed on the rear surface of the wafer and previously eliminating an element capable of decreasing vacuum pressure. CONSTITUTION: At least one vacuum hole(11) becomes vacuum when the wafer is absorbed. A vacuum line(12) supplies vacuum, connected to the vacuum hole. At least one air hole(23) injects air. At least one tweezer includes an air line(24) that supplies air, connected to the air hole. The air hole is located in a position that is more closer to the end part of the wafer transfer apparatus(20) than the vacuum hole.
申请公布号 KR20030094798(A) 申请公布日期 2003.12.18
申请号 KR20020032088 申请日期 2002.06.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, CHUNG HUN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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