METHOD FOR FABRICATING BUMP WITH ELECTROLESS NICKEL PLATING LAYER

摘要

PURPOSE: A method for fabricating a bump with an electroless nickel plating layer is provided to interconnect products with a large number of pins by performing an electroless plating process, and to prevent the pitch between bumps from being influenced by a lateral growth by performing an etch process after the electroless plating process. CONSTITUTION: An input/output pad(12) and a passivation layer(14) are formed of a predetermined pattern, included in a side surface of an integrated circuit chip(10). The side surface of the integrated circuit chip is cleaned in a pretreatment process. A zincate process is performed on the surface of the input/output pad of the cleaned integrated circuit chip to distribute zinc atoms to the surface of the input/output pad. Nickel is electroless-plated on the side surface of the integrated circuit chip. Photoresist(18) of a pattern corresponding to the input/output pad is formed on the nickel plating layer(16). While the photoresist of a predetermined pattern is applied, the nickel layer exposed to the outside is etched to leave the nickel plating layer corresponding to the input/output pad. The photoresist is eliminated from the nickel plating layer. Gold of a predetermined thickness is plated on the nickel plating layer from which the photoresist is removed.