发明名称 |
Wafer level MEMS packaging |
摘要 |
An exemplary method and apparatus for MEMS device wafer level and/or array packaging comprises inter alia an EM shielding array of dielectric lid elements (340) sealed to a MEMS device die array (300) to produce a sealed MEMS device package array (330). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve hermetic sealing and/or EM shielding for any MEMS device. An exemplary embodiment of the present invention representatively provides for wafer level packaging of RF MEMS switches prior to device singulation. |
申请公布号 |
US2003230798(A1) |
申请公布日期 |
2003.12.18 |
申请号 |
US20020170184 |
申请日期 |
2002.06.12 |
申请人 |
LIN JONG-KAI;LYTLE WILLIAM H.;FAY OWEN;MARKGRAF STEVEN;HUGHES HENRY G.;AMRINE CRAIG;DE SILVA ANANDA P. |
发明人 |
LIN JONG-KAI;LYTLE WILLIAM H.;FAY OWEN;MARKGRAF STEVEN;HUGHES HENRY G.;AMRINE CRAIG;DE SILVA ANANDA P. |
分类号 |
B81B7/00;H01L21/50;H01L23/552;(IPC1-7):H01L23/12 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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