发明名称 |
LASERBEARBEITUNGSVORRICHTUNG UND LASERBEARBEITUNGSVERFAHREN |
摘要 |
<p>In a laser machining device for cutting a round hole in a workpiece employing a machining program, a movement path includes a section from point P1 to point P2 (passing a hole previously formed in a workpiece) and reaches point P3 on a circle (40) to be cut. A section P2-P3 of the path is not a simple circular arc but is a curve whose radius of curvature gradually becomes approximate to the radius of a circle 40 to be cut as it gradually decreases towards the end point (P3) from the start point (P2) where the radius of the curvature is largest. Thus, the change in acceleration at points P2 and P3 of the section P1-P2-P3 of the path can be controlled to low levels. <IMAGE></p> |
申请公布号 |
DE69628813(T2) |
申请公布日期 |
2003.12.18 |
申请号 |
DE1996628813T |
申请日期 |
1996.10.02 |
申请人 |
FANUC LTD., YAMANASHI |
发明人 |
MORI, ATSUSHI;NAKATA, YOSHINORI |
分类号 |
B23K26/00;B23K26/08;B23K26/38;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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