发明名称 METHOD AND APPARATUS FOR COOLING A CIRCUIT COMPONENT
摘要 An apparatus (41, 441) includes a thermally conductive section (141, 241, 34 1, 444, 541) with a side facing approximately parallel to an axis (158) and adapted to be thermally coupled to a circuit component (36), and includes a fluid supply section (121) which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.
申请公布号 CA2488700(A1) 申请公布日期 2003.12.18
申请号 CA20032488700 申请日期 2003.06.05
申请人 RAYTHEON COMPANY 发明人 WYATT, WILLIAM GERALD;SCHWARTZ, GARY J.
分类号 G06F1/20;H01L23/367;H01L23/467;H05K7/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址