发明名称 Circuit board solder side cover
摘要 A solder side cover comprised of static dissipative flame retardant polypropylene materials and a forming process for making the cover. A press is provided having controlled upper and lower platens configured to clamp, cold form, punch and trim solder side covers with one series of strokes. In preferred embodiments pneumatic actuators are synchronized in a reciprocating slider crank configuration driven by an extensible link to apply a compounded clamp/form/punch action on the material in a progressive manner using a single actuation. A subsequent actuator is employed to perform the precision shearing, maintaining critical edge to hole tolerances. The mechanism is employed to provide adequate force throughout the extent of its rotation while controlling velocity and acceleration in such a fashion as to allow for material deformation without failing the material. Controlled forming forces impart a necessary but predictable stress to generate the impression and avoid warpage and undesirable forming variations. Actuator speeds are controlled by the geometry of the rotating link mechanism so as to provide for tool speed process range optimizations that can accommodate a variety of material modulus and material bend back (material memory) characteristics.
申请公布号 US2003231478(A1) 申请公布日期 2003.12.18
申请号 US20020171716 申请日期 2002.06.14
申请人 LUOMA ROY;SHEIN ROBERT 发明人 LUOMA ROY;SHEIN ROBERT
分类号 H05K5/03;(IPC1-7):H05K7/02;H05K7/04 主分类号 H05K5/03
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