| 摘要 |
<p>Provided is a seamless polishing pad comprising a seamless polishing layer (14) having a substantially uniform depth of penetration into a porous subpad (3). In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.</p> |
