| 摘要 |
<p>A flexible printed circuit board that exhibits extremely high adherence and realizes superfine patterning by etching; and a process for producing the same. In particular, a flexible printed circuit board produced by forming a copper thin-film constituted of copper or an alloy composed mainly of copper directly on at least one side of a plastic film substrate (1) and thereafter covering the copper thin-film with copper by an electroplating method, wherein the copper thin-film has a double layer structure having a layer at least containing a crystal structure formed on its front surface side, which crystal structure exhibits an X-ray relative intensity ratio at crystal lattice plane index (200)/(111) of 0.1 or below.</p> |
