METHOD FOR CUTTING NON-METALLIC MATERIALS AND DEVICE FOR CARRYING OUT SAID METHOD

摘要

The invention relates to material processing methods, in particular to methods for cutting and scribing non-metallic materials, mainly extra-hard materials (like corundum) provided with a semiconductive coating, glass, citalls, ceramics etc. The aim of said invention is to develop a method for cutting non-metallic materials, including extra-hard materials, and materials provided with a semiconductive coating with the aid of laser radiation. The pulse of said laser radiation has a set of parameters which provides the conditions for forming a mechanism for breaking down material by a collision and multiphoton ionisation, thereby producing a small-sized defect (the size thereof is closed to a diffraction limit). A real compatibility between laser pulse energy and energy required for producing a crack between two breakdown points is obtained by selecting the distance between said breakdown points.