发明名称 HEATER MODULE FOR SEMICONDUCTOR PRODUCTION SYSTEM
摘要 <p>A heater module and a semiconductor production system comprising it in which cooling rate of the heater can be increased greatly after heating without increasing the size or the cost of the semiconductor production system. The heater module comprises a heater section (1a) for controlling heating while mounting a wafer on the surface, and a block section (3a) disposed to move relatively to the heater section (1a) and vary the total heat capacity of the block section (3a) and the heater section (1a) by abutting on the rear side of the heater section (1a) or separating therefrom. Cooling rate of the heater can be set at 10˚C/min or above by setting the heat capacity at the block section (1b) not lower than 20% of the total heat capacity of the heater section (1a) and the block section (1b).</p>
申请公布号 WO03105199(A1) 申请公布日期 2003.12.18
申请号 WO2003JP06239 申请日期 2003.05.19
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;KUIBIRA, AKIRA;NAKATA, HIROHIKO 发明人 KUIBIRA, AKIRA;NAKATA, HIROHIKO
分类号 C23C16/46;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/02;H01L21/68;C23C16/00 主分类号 C23C16/46
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