RESIDUAL FILM MONITORING DEVICE, POLISHING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

A light beam from a white light source (404) is reflected from a white diffusing reflective plate (403) and diffused to illuminate substantially the whole surface to be polished of a wafer (Wm) chucked by a chuck substantially uniformly. The bright-field image of the whole area of the wafer (Wm) illuminated with the light is formed on an imaging surface of a color CCD (401) through a taking lens (402) by the light projected onto and reflected from the wafer (Wm) and is captured by the CCD (401). A processing unit (405) outputs the result of monitoring indicating whether or not any residual film is present over the whole surface to be polished of the wafer (Wm) according to the color image information acquired form the CCD (401). Thus, a residual monitoring device for adequately monitoring the state of any polishing residual film over the whole or wide area of the surface to be polished of an object to be polished can be provided.