发明名称 A wound healing antiscarring topical composition of centella and ginseng
摘要 <p>A wound healing antiscarring topical composition of centella and ginseng. It comprises centella whole extract in 0.01 - 1% by weight and ginseng extract in 0.01 - 0.5% by weight as actives and optionally formulating agents. A process for the preparation of the composition which comprises mixing the actives centella whole extract in 0.01 - 1% by weight and ginseng extract in 0.01 - 0.5% by weight optionally with formulating agents at 25-70 DEG C. A wound healing antiscarring medicated pad of centella and ginseng. The pad comprises a permeable material strip impregnated with centella whole extract in 0.01 - 1 % weight/weight and ginseng extract in 0.01 - 0.5% weight/weight as actives. A method of making the pad which comprises dissolving the actives centella whole extract and ginseng extract in a solvent such that the solution contains 0.008 - 0.8% and 0.008 - 0.4% weight/weight of the actives. A permeable material strip is impregnated with the solution of the actives such that the percentage weight pick-up or add-on weight thereon is 130 +/- 40%. The medicated strip is dried to evaporate the solvent. <IMAGE></p>
申请公布号 EP1221325(A3) 申请公布日期 2003.12.17
申请号 EP20020250129 申请日期 2002.01.09
申请人 JOHNSON & JOHNSON LIMITED 发明人 ALAIN, KHAIAT;SITARAM, MANKE AJIT;MINI, THOMAS;SHANKAR, TELANG AJIT;NAYARAN, ABHYANKAR PRASHANT
分类号 A61K9/70;A61K36/00;A61K36/23;A61K36/258;A61P17/02;(IPC1-7):A61P17/02;A61K35/78 主分类号 A61K9/70
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