| 发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS |
| 摘要 |
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased. <IMAGE> |
| 申请公布号 |
EP1372364(A1) |
申请公布日期 |
2003.12.17 |
| 申请号 |
EP20020801550 |
申请日期 |
2002.10.11 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
TATSUMI, KIYOHIDE;NISHII, TOSHIHIRO;NAKAMURA, SHINJI |
| 分类号 |
H05K3/46;B29C33/68;B29C43/18;B29C43/20;B29C43/36;B29C70/68;B30B15/06;H05K1/11;H05K3/40;(IPC1-7):H05K3/46;B29C43/32 |
主分类号 |
H05K3/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
