| 发明名称 |
Method of manufacturing micro-semiconductor element |
| 摘要 |
<p>A method of manufacturing a micro-semiconductor element comprising the following steps of: adhering a semiconductor wafer 10 having a circuit surface and a back surface to a support plate 20 via a protective film 22 so that the circuit surface faces to the protective film; reducing a thickness of the semiconductor wafer while the semiconductor wafer is supported by the support plate; dividing the semiconductor wafer into, individual semiconductor elements 10a while the semiconductor wafer is adhered to the protective film; moving the semiconductor elements from the protective film to an adhesive peeling film 26 in such a manner that the back surfaces of the semiconductor elements are adhered to the peeling film; supporting a periphery of the peeling film by a support ring 28; and picking up the individual semiconductor element by a pickup device when the back surface of semiconductor element is pushed up, via the peeling film, by a pushup pin 30. An individual semiconductor element can also be picked up by an air suction nozzle 36. <IMAGE></p> |
| 申请公布号 |
EP1372192(A2) |
申请公布日期 |
2003.12.17 |
| 申请号 |
EP20030012862 |
申请日期 |
2003.06.06 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
KOIZUMI, NAOYUKI;MASHINO, NAOHIRO;KURIHARA, TAKASHI |
| 分类号 |
H01L21/52;H01L21/78;H01L21/00;H01L21/301;H01L21/304;H01L21/44;H01L21/68;H01L21/683;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/52 |
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代理人 |
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