发明名称 |
Surface acoustic wave device |
摘要 |
A metallized electrode is provided at a fixed location of the main body of a package such that the metallized electrode is located above signal electrodes and is not in contact with the signal electrodes and an insulating joining material. Also, the metallized electrode is made conductive to the grounding electrode.
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申请公布号 |
US6664709(B2) |
申请公布日期 |
2003.12.16 |
申请号 |
US20010917993 |
申请日期 |
2001.07.30 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
IRIE YUJI |
分类号 |
H01L23/02;H03H9/05;H03H9/25;(IPC1-7):H01L41/08 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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