| 摘要 |
In a method of producing three-dimensional circuits, a first and a second substrate are first provided, each of said substrates having arranged therein a plurality of components which have been tested with regard to their operability. The second substrate is diced so as to obtain a plurality of individual chips, each individual chip comprising at least one component. Subsequently, the individual chips are arranged on the first substrate and connected to said first substrate so that operative components in said first substrate are connected to individual chips including an operative component, and so that non-operative components in said first substrate are connected to chip elements having no function, so as to obtain a three-dimensional complete structure. Finally, the three-dimensional complete structure is diced so as to obtain three-dimensional circuits.
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