| 摘要 |
A retaining substrate for mounting a semiconductor element thereon, having a circuit pattern for said semiconductor element, characterized in that said substrate comprises an insulative material, said substrate has a surface configuration having a cross section comprising (a) an uneven shaped portion and (b) a concave shaped portion which are arranged in tandem wherein a surface of said uneven shaped portion (a) makes a bottom face of said concave portion (b), and said uneven shaped portion (a) has a structure in that (a-i) an insulative convex shaped portion and (a-ii) an insulative concave shaped portion are alternately arranged so as to neighbor with each other, and said circuit pattern is provided in said concave shaped portion (a-ii) of said uneven shaped portion (a).
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