Lead frame and bottom lead semiconductor package using the lead frame

摘要

A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between the dam bar; a tie bar for supporting the die paddle; a plurality of leads each consisting of a first lead having a predetermined length extended from the dam bar between the dam bar and the die paddle, a second lead connected electrically to the first lead and formed bent in a first direction, and a third lead connected electrically to the second lead and formed bent in a second direction.