| 摘要 |
Integrated circuit (IC) package structures and IC package fabrication techniques are provided. The IC package substrate is formed from a metal sheet that is patterned to form a substrate with pads and leads. These pads and leads are pattered throughout the substrate including at least part of the die mounting area. The die is mounted onto the die mounting area of the lead-frame, and respective bonding terminals on the die are electrically connected to the associated bonding areas on the patterned leads. A protective encapsulant is molded to cover the die, bond wires, and most, if not all, of the patterned substrate. Contacts for external electrical connection are formed onto the bottom of the pads.
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