发明名称 |
Apparatus for applying a semiconductor chip to a carrier element with a compensating layer |
摘要 |
A method and an apparatus are described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.
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申请公布号 |
US6664648(B2) |
申请公布日期 |
2003.12.16 |
申请号 |
US20010809860 |
申请日期 |
2001.03.16 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WINDERL JOHANN;HAUSER CHRISTIAN;REISS MARTIN |
分类号 |
H01L21/56;H01L21/60;(IPC1-7):H01L23/29 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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