发明名称 Methods and apparatus for defect localization
摘要 The present invention includes a system for localization of defects in test samples. A sample is scanned using a particle beam. Some particles interact with conductive elements and may cause the emission of x-rays. Other particles can pass through the sample entirely and generate a current that can be measured. A higher current generated indicates less conductive material at the scan target that may mean a void, dishing, or erosion is present. Localization of a defect can be confirmed using an x-ray emission detector.
申请公布号 US6664541(B2) 申请公布日期 2003.12.16
申请号 US20010990170 申请日期 2001.11.21
申请人 KLA TENCOR TECHNOLOGIES CORPORATION 发明人 NASSER-GHODSI MEHRAN;REICHERT JEFFREY
分类号 H01L21/66;G01N23/225;H01J37/244;H01J37/28;(IPC1-7):H01J37/28;H01J37/00 主分类号 H01L21/66
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