发明名称 Method for forming damascene metal gate
摘要 The present invention relates to a method of forming a damascene gate electrode of highly integrated MOS transistor capable of easily removing a dummy polysilicon layer. The disclosed comprises the steps of forming a dummy gate insulating layer and a polysilicon layer for a dummy gate on a wafer; forming an interlayer insulating layer on the wafer; polishing the interlayer insulating layer to expose a top surface of the dummy polysilicon layer; and wet etching the exposed dummy polysilicon layer using a spin etching process.
申请公布号 US6664195(B2) 申请公布日期 2003.12.16
申请号 US20010974811 申请日期 2001.10.12
申请人 HYNIX SEMICONDUCTOR, INC. 发明人 JANG SE AUG;SUN JUN HYEUB;CHOI HYUNG BOK
分类号 H01L29/417;H01L21/28;H01L21/302;H01L21/306;H01L21/3065;H01L21/3213;H01L21/336;H01L21/461;H01L21/8238;H01L29/78;(IPC1-7):H01L21/302 主分类号 H01L29/417
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