发明名称 High speed interconnect using printed circuit board with plated bores
摘要 A printed circuit board includes a bore having a perimeter and a total depth. An electrically conductive barrel extends around at least a portion of the perimeter of the bore and along a predetermined depth of the bore, the predetermined depth being less than the total depth of the bore. The barrel has an end that terminates at a countersunk portion of the bore. A contact includes a body having first and second ends. The first end includes a compliant section that is positioned in the barrel, thereby forming a separable interface between the contact and the circuit board. The second end extends out of the barrel and interfaces with an electrical component. Protrusion of the first end out of the barrel is minimized. The above relationships are used to decrease capacitive loading.
申请公布号 US6663442(B1) 申请公布日期 2003.12.16
申请号 US20000491658 申请日期 2000.01.27
申请人 TYCO ELECTRONICS CORPORATION 发明人 HELSTER DAVID W.;MICKIEVICZ SCOTT K.;ANDREWS HOWARD W.;DEFIBAUGH GEORGE R.;SIPE LYNN R.;CONSOLI JOHN J.;FEDDER JAMES L.;MORGAN CHAD W.;SHARF ALEXANDER M.;MCALONIS MATTHEW R.
分类号 H01R12/32;H01R12/04;H05K1/11;H05K1/14;H05K3/00;H05K3/42;(IPC1-7):H05K1/11 主分类号 H01R12/32
代理机构 代理人
主权项
地址