| 摘要 |
The invention is a mounting structure of a high-frequency wiring board in which when a pitch between a conductive connecting member connected to a high-frequency signal electrode pad of a high-frequency wiring board and a conductive connecting member connected to a ground electrode pad adjacent thereto is denoted by A and a maximum diameter of these conductive connecting members in sections parallel to the lower face of the high-frequency wiring board is denoted by B, A/B>=2 is satisfied, and a space L1 between the lower face of the high-frequency wiring board and the upper face of the external electric circuit board is one sixteenth or less of a wavelength of high-frequency signals processed by a high-frequency semiconductor element.
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