发明名称 |
Tape carrier package having stacked semiconductor elements, and short and long leads |
摘要 |
A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.
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申请公布号 |
US6664618(B2) |
申请公布日期 |
2003.12.16 |
申请号 |
US20020125444 |
申请日期 |
2002.04.19 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TAKAHASHI YOSHIKAZU;KOBAYASHI KANAME |
分类号 |
H01L23/495;(IPC1-7):H01L23/495;H01L23/06;H01L23/02;H01L23/34;H01L23/28 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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