发明名称 |
CARTE DE CIRCUIT INTEGRE ET PROCEDE DE FABRICATION DE CELLE-CI |
摘要 |
An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.
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申请公布号 |
FR2840711(A1) |
申请公布日期 |
2003.12.12 |
申请号 |
FR20030050209 |
申请日期 |
2003.06.10 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KIM DEOK HEUNG;KIM CHANG GYOO;LEE SEUNG SEOB |
分类号 |
B42D15/10;G06K19/077;H01L25/00;H05K1/11;H05K1/14;H05K3/28;(IPC1-7):G06K19/077;H01Q1/22 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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