Plastic support medium in electronics industry, includes nitrogenous moieties and palladium moieties provided at interface of plastic material and non-metallised plastic material

摘要

The medium includes a plastic material partially coated by metallic deposit. The non-metallised plastic material is provided on the plastic material. The nitrogenous moieties and palladium moieties are provided at the interface of the materials. The inner and external layers are formed on the interface. The material consists of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), syndiotactic polystyrene (SPS) or liquid crystal polymer (LCP).