WAFER LIFTING APPARATUS OF SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT

摘要

PURPOSE: A wafer lifting apparatus of a semiconductor device manufacturing equipment is provided to be capable of preventing a wafer from being deviated out of a plurality of support bars for improving manufacturing yield by using a positioning groove. CONSTITUTION: A wafer lifting apparatus of a semiconductor device manufacturing equipment is provided with a chuck assembly(20) for loading a semiconductor wafer and a plurality of support bars(22) installed through the predetermined portions of the chuck assembly corresponding to the edge portion of the semiconductor wafer. At this time, the support bar is capable of being moved up and down. At the time, the support bar includes a head portion(24). The wafer lifting apparatus further includes a plurality of positioning grooves(26) formed on the upper surface of the chuck assembly for inserting the head portion of the support bar and a supporting plate(14) for fixing the lower end portion of the support bar.