Memory card and a method of manufacturing the same

摘要

A memory card is disclosed which not only suppresses a lowering of the manufacturing yield caused by warping of a semiconductor chip sealing member, but also reduces the manufacturing cost by using a less expensive material. The memory card comprises a thin plate-like cap formed of a synthetic resin and a sealing member mounted inside the cap. Inside the sealing member are sealed a metallic lead frame and three semiconductor chips (two memory chips and one control chip) mounted on part (leads) of the lead frame. The semiconductor chips are electrically connected to leads through Au wires. Connecting terminals integral with the lead frame are exposed to the back side of the sealing member.