Processing substrate and/or support surface

摘要

A single use processing substrate including a first cut-resistant layer having a first surface area and including an absorbent ply and a thermoplastic material ply, wherein the first layer includes a plurality of non-circular apertures therein and a second layer having a second surface area and including an absorbent ply and a thermoplastic material ply, wherein the first layer is secured to the second layer such that a portion of the second surface area is laterally disposed outside of the first surface area.