| 摘要 |
<p>When an impact (G) is applied to a buffer device (24), a built-in unit tends to displace toward third and fourth slide regions (36 and 37) by the reaction of the impact (G). Elastically deformable regions (38, 39, 42 and 43) are crushed. The third and fourth slide regions (36 and 37) separate from each other. The displacements of the third and fourth slide regions (36 and 37) are transmitted to first and second slide regions (27 and 28) via first and second connection regions (45 and 55). The first and second slide regions (27 and 28) approach each other. The elastically deformable regions (29, 31, 33 and 34) elastically deform. Contact regions (25a and 25b) are pressed against the built-in unit (22). The kinetic energy of the impact (G) is consumed by the entire buffer device (24). The impact transmitted to the built-in unit (22) is considerably reduced thereby.</p> |
