发明名称 |
Heat-conductive silicone rubber composition |
摘要 |
A heat-conductive silicone rubber composition is provided. This composition comprises (A) an organopolysiloxane with an average of at least 0.1 alkenyl groups bonded to silicon atoms within each molecule, (B) an organopolysiloxane with an average of at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a heat-conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane with a hydrolyzable group and a vinyl group, as represented by a general formula shown below. This composition displays superior molding workability and adhesion, even if a large quantity of a heat-conductive filler is added to the composition.
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申请公布号 |
US2003229174(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20030350036 |
申请日期 |
2003.01.24 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
GOTO TOMOYUKI;OZAI TOSHIYUKI;IWATA MITSUHIRO;INOUE YOSHIFUMI |
分类号 |
C08J5/00;C08K3/00;C08K3/08;C08K3/22;C08K3/34;C08L83/04;C08L83/05;C08L83/07;C08L83/14;(IPC1-7):C08L83/00 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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