发明名称 Laser irradiation method and method of manufacturing a semiconductor device
摘要 A method of manufacturing a semiconductor device is provided which uses a laser crystallization method capable of increasing substrate processing efficiency. An island-like semiconductor film including one or more islands is formed by patterning (sub-island). The sub-island is then irradiated with laser light to improve its crystallinity, and thereafter patterned to form an island. From pattern information of a sub-island, a laser light scanning path on a substrate is determined such that at least the sub-island is irradiated with laser light. In other words, the present invention runs laser light so as to obtain at least the minimum degree of crystallization of a portion that has to be crystallized, instead of irradiating the entire substrate with laser light.
申请公布号 US2003228723(A1) 申请公布日期 2003.12.11
申请号 US20020314452 申请日期 2002.12.09
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;SHIBATA HIROSHI;TANAKA KOICHIRO;HIROKI MASAAKI;AKIBA MAI
分类号 H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L21/00 主分类号 H01L21/20
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