COOLING ELEMENT FOR AN ELECTRONIC DEVICE

摘要

The invention relates to a cooling element to be used as a heat sink for an electronic device (1, 11, 21, 31), as a microprocessor, which contains a base member (2, 12, 22, 32) attached in one side to the electronic device (1, 11, 21, 31) and in other side providing separate members for distribution (3, 17, 23, 33) of heat and for supporting a fan (6, 15, 25, 35) installed in a cavity in the middle of members for distribution (3, 17, 23, 33) and creating airflow for heat transfer. According to the invention at least one fin member (4, 18, 28, 38) is installed in space between of two adjacent distribution members (3, 17, 23, 33).