Pattern forming method and pattern forming device

摘要

A pattern forming method has the steps of: forming a pattern by discharging droplets of a conductive material forming solution onto an insulating substrate; forming a conductive layer pattern on the pattern by discharging droplets of a solution which becomes a growth core; and forming a metal pattern by immersing the conductive layer pattern in a plating liquid. The pattern forming method may further have the step of forming a protective layer on a surface of the metal pattern by discharging droplets of an insulating material forming solution except at regions which are to become electrodes of the metal pattern.